Industrial System on Module
Compact power and versatile integration
Industrial System on Module Series
NK-L317-J6412 COMLAC SoM
Proprietary form COMLACTM factor, support Intel® 6-11th Gen.Core™ i3/i5/i7, and Celeron® J6412, J1900, processors, custom design carrier boards
More About Nodka's COMLAC SoM and Design
COMLAC™ is a multi-functional small form factor computer core module developed by Nodka, based on the X86 modular bus standard. It integrates Nodka’s extensive experience with ETX, COM Express, Qseven, and SMARC technologies, addressing the needs for low power consumption and compact size while delivering high performance. COMLAC™ combines the high capability of COM Express with the smaller size and lower cost advantages of Qseven and SMARC, along with enhanced upgradability, making it a reliable and versatile solution for industrial applications.
COMLAC™ SoM Features
COMLAC™ SoM CPU modules utilize low-power x86 SoCs, designed for power consumption between 10W and 30W in a compact form factor of 82 x 95 mm. These modules offer powerful computing performance based on Intel’s latest Core processor platforms, making them suitable for applications requiring high performance with low power consumption, such as fanless industrial PCs, panel PCs, HMIs, automation PCs and other embedded systems. The CPU core and other high speed sub-systems, including memory, BIOS, power management, and Ethernet, are integrated on the module. When paired with a carrier board, the COMLAC™ module supports functions like VGA/DVI/HDMI, audio, touch control, wireless connectivity, and other custom-designed circuits. This modular design provides advantages such as flexibility in upgrades, fast time to market, varied applications, lower power consumption, and a smaller physical footprint.
The Modular Concept of COMLAC™ Carrier Board
- Designers can determine the physical structure of the carrier board without form factor restrictions (e.g., ATX, Mini-ITX, 3.5-inch, or 5.25-inch).
- Compatibility design allows the same carrier board to work with different CPU core modules, offering flexibility for platform upgrades and cost control.
- Modularizing the most complex parts of the motherboard reduces R&D costs and accelerates time-to-market.
- Enables quick implementation of custom hardware designs, reducing the need for additional cables and improving product integration and reliability.
- Reduces current and future design risks, allows customers to adopt new technologies rapidly and maintains upgradability for future development.
Custom Design and OEM/ODM Services
Our OEM/ODM services complement the Industrial COMLAC™ SoM and carrier board product line by offering tailored design and manufacturing solutions to meet specific industrial requirements. With capabilities in custom hardware design, in-house SMT production, and FPGA I/O design, we ensure each module and board design is optimized for performance and reliability. Additional services like custom BIOS, real-time OS BIOS modifications, and OS verification further enhance the functionality and integration of these modular SBCs. This comprehensive approach allows Nodka to deliver high-quality, customized COMLAC™ SoM and carrier boards that cater to diverse industrial applications, ensuring robust and efficient performance.
